JCET Group Co., Ltd. provides integrated-circuit manufacturing and technology services worldwide. The company offers wafer level packaging, system-in-packaging, flip chip, and wire bonding products for various semiconductor applications, such as mobile, communication, compute, consumer, automotive, industry, etc. It also provides design and characterization, research and development, wafer probe, water bump, package assembly, shipment, and test services. The company was formerly known as Jiangsu Changjiang Electronics Technology Co., Ltd. and changed its name to JCET Group Co., Ltd. in November 2019. JCET Group Co., Ltd. was founded in 1972 and is based in Jiangyin, China.

JCET Group Co., Ltd.

Amkor Technology, Inc. provides outsourced semiconductor packaging and test services in the United States, Japan, Europe, the Middle East, Africa, and the rest of the Asia Pacific. It offers turnkey packaging and test services, including semiconductor wafer bump, wafer probe, wafer back-grind, package design, packaging, and test and drop shipment services. The company also provides flip chip-scale package products for use in smartphones, tablets, and other mobile consumer electronic devices; flip-chip stacked chip-scale packages that are used to stack memory on top of digital baseband, and as applications processors in mobile devices; and flip-chip ball grid array packages for various networking, storage, computing, and consumer applications. In addition, it offers wafer-level CSP packages that are used in power management, transceivers, sensors, wireless charging, codecs, radar, and specialty silicon; wafer-level fan-out packages for use in ICs; and silicon wafer integrated fan-out technology, which replaces a laminate substrate with a thinner structure. Further, the company provides lead frame packages that are used in electronic devices for low to medium pin count analog and mixed-signal applications; substrate-based wirebond packages, which are used to connect a die to a substrate; micro-electro-mechanical systems (MEMS) packages that are miniaturized mechanical and electromechanical devices; and advanced system-in-package modules, which are used in radio frequency and front end modules, basebands, connectivity, fingerprint sensors, display and touch screen drivers, sensors and MEMS, and NAND memory and solid-state drives. It primarily serves integrated device manufacturers, fabless semiconductor companies, original equipment manufacturers, and contract foundries. Amkor Technology, Inc. was founded in 1968 and is headquartered in Tempe, Arizona.

Amkor Technology, Inc.

ASE Technology Holding Co., Ltd. provides a range of semiconductors packaging and testing, and electronic manufacturing services in the United States, Taiwan, rest of Asia, Europe, and internationally. It offers packaging services, including flip chip ball grid array (BGA) and chip scale package (CSP), advanced chip scale packages, quad flat packages, low profile and thin quad flat packages, bump chip carrier and quad flat no-lead (QFN) packages, advanced QFN packages, plastic BGAs, and 3D chip packages; stacked die solutions in various packages; and copper and silver wire bonding solutions. The company also provides advanced packages, such as flip chip BGA; heat-spreader FCBGA; flip-chip CSP; hybrid FCCSP; flip chip package in package and package on package (POP); advanced single sided substrate; high-bandwidth POP; fan-out wafer-level packaging; SESUB; and 2.5D silicon interposer. In addition, it offers IC wire bonding packages; system-in-package products (SiP) and modules; and interconnect materials, as well as assembles automotive electronic products. Further, the company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, logic/mixed-signal/RF module and SiP/MEMS/discrete final testing, and other test-related services, as well as drop shipment services. Additionally, it develops, constructs, sells, leases, and manages real estate properties; produces substrates; offers information software, equipment leasing, investment advisory, and warehousing management services; processes and sells computer and communication peripherals, electronic components, telecommunications equipment, and motherboards; and imports and exports goods and technology. The company was incorporated in 1984 and is headquartered in Kaohsiung, Taiwan.

ASE Technology Holding Co., Ltd.

Tongfu Microelectronics Co.,Ltd provides integrated circuit (IC) packaging and testing services to the semiconductor industry. It offers wafer probe, strip testing, final testing, and system level testing semiconductor testing services; test platform and engineering services for analog and mixed signal, automotive, radio frequency, high-performance calculated devices, baseband ,memory devices, LCD driver devices, SiP devices, power module devices, and integrated circuits; and test products that includes CPU, GPU, gaming consoles, and networking products. The company was formerly known as Nantong Fujitsu Microelectronics Co., Ltd. and changed its name to Tongfu Microelectronics Co.,Ltd in December 2016. Tongfu Microelectronics Co.,Ltd was founded in 1997 and is headquartered in Nantong, China.

Tongfu Microelectronics Co.,Ltd

King Yuan Electronics Co., Ltd. engages in the designing, manufacturing, selling, testing, and assembly service of integrated circuits worldwide. It offers memory IC test solutions for memory applications, such as flash memory, mask-ROM, EPROM, EEPROM, DRAM, SDRAM, RDRAM, DDRI and DDRII, SRAM, pseudo SRAM, and memory embedded ICs; and consumer electronics testing solutions, including games, digital audio, digital TV, set-top box, and others. The company also provides logic and mixed-signal IC test solutions for audio/video, ODD IC's, chipset, xDSL, MB/GB Ethernet, MAC, PHY, BB, MCU, AC/DC converter, embedded controllers, LVDS, USB, firewire, etc.; and liquid crystal display (LCD) driver test solutions for use in high pixel count LCD panels comprising super extended graphics array and ultra-extended graphics array. In addition, it offers CMOS image, DPS/EMBED DRAM image, charge-coupled device image, high resolution and high speed image, and integration SOC image sensors for cameras, cellular phones, and video recorder; and radio frequency IC test solutions, which include WLAN 802.11a/b/g/n, WLAN combo, MAC, baseband, RF IC, RF SOC, and RF mixed-signals, as well as cellular phone type applications. Further, the company provides system on chip (SOC) test solutions, such as testing, diagnosis, verification, characterization, and debugging services for SOC devices comprising ASIC and ASSP; solutions to test various kinds of multi-mode MEMS devices comprising microphones, gyroscope, acceleration sensor, electronic compass, and pressure sensors; and biochip testing solutions. Additionally, it offers ball grid array, QFN/DFN/WSON, thin small outline, land grid array, eMMC/eMCP/MCP, and memory card package services. The company also manufactures and sells IC burn-in systems and wafer level burn-in systems. King Yuan Electronics Co., Ltd. was incorporated in 1987 and is headquartered in Hsinchu, Taiwan.

King Yuan Electronics Co., Ltd.

Powertech Technology Inc., together with its subsidiaries, researches, designs, develops, assembles, manufactures, packages, tests, and sells various integrated circuit (IC) products primarily in Taiwan. It offers packaging and testing services, such as high pin-count thin small outline package, multi-chip packaging (MCP, S-MCP), ball grid array (wBGA, FBGA) IC, solid state drive (SSD), embedded memory (eMMC, eMCP, UFS), DRAM chip-stacking, mobile memory, Package on Package/Package in Package, CMOS image sensor, and fan-out panel level, as well as secured digital memory card (SD, microSD) and USB. The company also provides Quad Flat No-leads, wafer bumping, system-in-package, wafer level chip scale package, flip-chip, copper pillar bump flip chip, electro-magnetic interference shield package, and module and system packaging services; and wafer testing and redistribution layer services. In addition, it is involved in the design, manufacturing, assembly, testing, and sale of semiconductors, as well as investment and wafer probing testing activities. The company also operates in Japan, Singapore, the United States, Europe, China, Hong Kong, Macao, and internationally. Powertech Technology Inc. was incorporated in 1997 and is headquartered in Hsinchu City, Taiwan.

Powertech Technology Inc.

ChipMOS TECHNOLOGIES INC. engages in the research, development, manufacture, and sale of high-integration and high-precision integrated circuits, and related assembly and testing services in Taiwan, People's Republic of China, Japan, Singapore, and internationally. It operates through Testing; Assembly; Testing and Assembly for LCD, OLED and other Display Panel Driver Semiconductors; Bumping; and Other segments. The company provides a range of back-end assembly and testing services, including engineering test, wafer probing, and final test of memory and logic/mixed-signal semiconductors, as well as leadframe-based and organic substrate-based package assembly services for memory and logic/mixed-signal semiconductors; and gold bumping, reel to reel assembly, and test services for LCD and other panel display driver semiconductors. Its semiconductors are used in personal computers; graphics applications, such as game consoles; communications equipment; mobile products comprising cellular handsets, tablets, and consumer electronic products; and automotive/industry and display applications, such as display panels. The company was incorporated in 1997 and is headquartered in Hsinchu, Taiwan.

ChipMOS TECHNOLOGIES INC.

Hana Micron, Inc. engages in the provision of semiconductor packaging products and testing services. It offers flip chip ball grid array, flexible packaging, wafer level chip scare packaging, fine pitch ball grid array, lead frame base, analog test, logic test, and others. The company was founded on August 23, 2001 and is headquartered in Asan-si, South Korea.

HANA Micron Inc.

Tianshui Huatian Technology Co., Ltd. operates as an IC packaging and testing company. The company offers lead frame packaging products; and analog and mixed signal/RF testing services, as well as wafer probing, test development, and design and simulation services. It serves in China, Taiwan, Hong Kong, Singapore, South Korea, the United States, etc. Tianshui Huatian Technology Co., Ltd. was founded in 2003 and is based in Tianshui, China.

Tianshui Huatian Technology Co., Ltd.

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Ticker	Market Cap	Gross Profit Margin	Forward P/E
600584	$9,296.91M	13.0%	32.1
AMKR	$10,686.17M	13.5%	22.1
3711	$31,927.44M	16.7%	17.8
002156	$7,852.49M	14.8%	49.0
2449	$8,641.10M	35.0%	25.5
6239	$3,700.70M	18.2%	18.2
8150	$972.59M	9.5%	23.4
A067310	$1,138.75M	15.3%	33.1
002185	$5,050.23M	12.0%	38.8